Demos

iPSC is a specific  type of cell therapy that uses induced pluripotent stem cells (iPSCs). It is based on the reprogramming of adult cells into a pluripotent state and subsequently differentiating them into specific cell types for therapeutic applications. In this approach, cells replicating the tissue affected by disease are created and used to test drug efficacy, side effects, and toxicity, as well as to develop new drugs and therapies.

Discover the different technology blocks for cell manufacturing – the cell sorter chip, micro-electrode array chip for electroporation, lens-free imaging chip, and multi-sensor chip for process analytical technology quality control. The integration of the different processes for iPSC manufacturing with chip technology allows for high-throughput systems with the potential for point-of-care applications – miniature bioreactors delivering the personalized therapy at the patient's bedside.

Nanopores are tiny holes that can be used to detect, quantify and sequence single molecules such as DNA, RNA, and proteins – if combined with fluidics, bio-surfaces, electronics and data processing. The advantage is that it is a fast (no amplification needed) and label-free detection technique.

Imec provides a manufacturable nanopore platform on which single-molecule sensors can be built. Imec is actively looking for assay partners that want to develop their applications on imec’s minimal viable demonstrator (MVD): a multi-pore array combined with fluidics and read-out electronics. For the latter, imec works with Elements Biosciences. At ITF World, imec demonstrates live single-molecule sensing with nanopores.

High-throughput read-out of arrays of fluorescently-tagged molecules has fuelled the rise of next-gen DNA sequencing. It is also the basis of several new proteomic technologies. However, it typically comes with high instrumentation costs and long scan times.

Imec is overcoming these limitations with a lens-free approach. Monolithic integration of photonics-based structured illumination with image sensor read-out on a single chip results in a high-resolution, high-throughput fluorescence imaging system. This system is both robust and compact. Explore the unique lens-free microscopy chip design and learn how imec’s advanced post-processing capabilities enable this breakthrough innovation. A packaged chip will be on display. 

Microphysiological systems (MPS) provide a more physiologically relevant alternative to traditional animal models. They enable the study of human biology, diseases, and drug responses in a modality that better mimics real human conditions. However, these systems are typically limited by scalability and rely on endpoint and label-based methods. In contrast, silicon nanofabrication allows for mass manufacturing, high reproducibility, and sensor integration, unlocking new insights into 3D biological tissues.

Imec is launching a co-development and collaboration program focused on full-system preclinical MPS, encompassing bio-, hardware-, and software solutions. In this demo, imec highlights four key technologies, showcasing its expertise in the integration and post-processing of specialized features. These include a blood-brain barrier chip, a high-throughput chip with integrated oxygen and glucose sensors, a multi-electrode array chip for single-cell detection, and a micro-ELISA photonic chip for detecting multiple antibodies with high accuracy and in a very short time. All of these technologies can be integrated into a single system. The rich, high-quality data generated by this platform open up new opportunities for training advanced AI models, potentially accelerating drug discovery.

Nerve stimulation is being studied as a non-pharmacological alternative for treating conditions such as chronic pain, depression, and inflammatory diseases. However, the traditional neuromodulation approaches often result in multiple side effects and low therapeutic efficacy. Novel nerve-stimulation devices are needed that not only are smaller and low power, but also act more targeted, resulting in fewer side effects.

Imec has developed a custom chip for implantable pulse generators (IPGs). Central to the innovation is the use of imec’s patented intermittent interferential current stimulation (i²CS). The solution stands out due to its enhanced precision and closed-loop potential (i.e. stimulation and sensing in one system). The technology was validated by a medical research partner. At this booth, imec demonstrates the chip and the closed-loop system built around this chip.

Neuropixels probes are miniaturized, high-density tools designed for high-resolution brain-wide neural-signal recording and optical brain stimulation. Widely adopted in over 1000 laboratories worldwide, they play a crucial role in studying brain function and behavior in animal models. These cutting-edge probes are designed, developed, and manufactured by imec, in collaboration with HHMI Janelia Research Campus, the Allen Institute for Brain Science, and University College London.

In this demo, imec showcases the whole Neuropixels portfolio, and the most recent results of in-human studies.

In the intensive care unit (ICU), early identification of patient deterioration is crucial for timely interventions and prevention of adverse outcomes. Unobtrusive health monitoring methods could enable this early identification by continuously assessing patients, even while they wait or check in.

Imec has developed an optical vital sign monitoring technology, based on Speckle plethysmography (SPG). It can be integrated into the infrastructure of a waiting room or registration kiosk, to measure for example, heart rate, heart-rate variability, blood pressure, and respiration. These data can be used to determine an early warning score (EWS) for each patient. The sensor technology and algorithms outperform other systems in terms of signal quality, insensitivity to ambient light conditions, number of measured parameters, and number of patients that can be monitored at the same time.

By detecting wavelengths beyond the visible spectrum, shortwave infrared (SWIR) sensors can provide enhanced contrast and detail, as materials reflect differently in this range. These sensors can distinguish objects that appear identical to the human eye and penetrate through fog or mist, making them invaluable for applications such as face recognition or eye tracking in consumer electronics, and autonomous vehicle navigation. While current versions are costly and limited to high-end applications, wafer-level integration promises broader accessibility.

Imec develops quantum-dot image sensor technology that enables compact and cost-effective SWIR cameras. Moreover, imec offers an environmentally friendly alternative to first-generation quantum dots that contain lead, which limited their widespread manufacturing. In this demo, we will show a lead-free quantum-dot based SWIR camera that enables the visitors to see things that are invisible to the human eye (due to a smoke curtain).

In an era where high-performance imaging is crucial across industries – ranging from biomedical diagnostics and autonomous vehicles to space exploration and industrial inspection – off-the-shelf image sensors often fall short. Many cutting-edge applications demand higher sensitivity, advanced spectral capabilities, faster readout speeds, or unique form factors that conventional imagers cannot provide.

To address these challenges, imec develops custom imagers and new sensor architectures, pushing the boundaries of sensor performance, integration, and functionality. Leveraging its world-class semiconductor expertise and state-of-the-art 300mm R&D cleanroom, imec specializes in application-specific imagers based on wafer-level post-processing.

Nano-optics (also called flat optics) are much more compact as compared to traditional macro-optics such as filter, polarizers and lenses. Also, nano-optic components are processed using the well-established techniques from the microchip industry which makes them more cost-efficient and easier to upscale. Other advantages are its high design and material flexibility, the more accurate alignment, and the possibility to post-process these structures on complex chips and imager wafers. This makes it the perfect technology for integrating optical functionalities into (smartphone) cameras, displays, AR/VR glasses as well as in automotive and space applications.

Imec researches new nano-optic components and acts as manufacturing partner with unique and flexible post-processing capabilities, patterning and material expertise, for assisting companies in the full development process. At this demo, imec will show 200mm and 300mm wafers with meta-lenses on high-index glass, and with double-side patterning of flat optics.

Spectral imaging captures and analyzes light across multiple wavelengths, providing detailed information into the composition and characteristics of imaged objects. It can be used for earth observation, machine vision, forensics, health applications etc.

Imec developed a unique process to deposit and pattern thin-film optical filters on top of imagers, at wafer level. This results into spectral imaging sensors that can easily be integrated into compact spectral cameras for high-resolution scanning or real-time video-mode applications. Think for example of adding spectral vision to mini-satellites or to surgical instruments. Discover imec’s unique post-processing capabilities for spectral vision at this booth.

One way to further scale chips and add more functionality per area is to integrate circuits on top of each other, leveraging 2.5D or 3D connectivity. 3D integration is also a way to combine heterogeneous subsystems, i.e. dies made from different technologies.

Imec researches and develops different pathways for 3D integration – wafer-level 3D with die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding, back-side connectivity technologies, Si-interposer wafers and packages, and thermal test vehicles. At the demo, imec showcases 300mm wafers and packaged dies based on different 3D technologies.

New data-intensive applications such as artificial intelligence (AI) and machine learning (ML) are reshaping the von Neumann compute architecture and imposing high demand for DRAM memory. However, since about 2015, DRAM cost scaling has increasingly struggled to keep up with Moore’s law. New types of memory that are more cost-effective than conventional DRAM can complement DRAM in data-intensive compute applications.

Imec developed a novel memory concept of a charge-coupled device (CCD) with an indium gallium zinc oxide (IGZO)-based channel arranged in a 3D NAND-like architecture. The novelty of this 3D CCD buffer memory concept is the specific 3D nature, making the CCD technology highly dense and several times more cost-effective than DRAM. Learn more about this innovation at the demo booth.

AI-driven computing and the ML revolution have enabled technologies like generative AI, edge computing, and IoT. This requires large training datasets stored in specialized AI memory, which includes both low-latency on-chip and high-density off-chip solutions. To minimize power consumption, low leakage and low-power operation are essential. Emerging memories like MRAM and oxide semiconductor-based e-DRAM offer promising alternatives to traditional SRAM and DRAM.

In recent years, imec has demonstrated 300mm wafer-scale SOT-MRAM and e-DRAM with continuous improvements in performance, reliability, and process integration. At ITF, imec will outline AI memory roadmaps and a 3-year plan for a 300mm pilot line, showcasing their potential for applications in data centers, edge, and IoT.

Qubits, or quantum bits, are the building blocks of quantum computing. At imec, researchers focus on developing spin and superconducting qubits, leveraging advanced 300mm fabrication tools to enable scalable production. The goal is to achieve high coherence times, minimal variability, and excellent yield, paving the way for practical quantum technologies.

This demo showcases the performance, key process steps and manufacturability of imec’s qubit technology, and its advanced integration in the 300mm fab. Additionally, packaged qubit devices will be on display.

Optical communication for data transmission – between chips, processors, or computing components – enables higher bandwidth, lower latency, and reduced power consumption as compared to traditional electrical signalling. Imec develops the building blocks for such optical I/O applications – lasers, modulators, detectors, as well as the interface electronics, packaging and integration technologies.

Imec presents its latest photonic devices, allowing visitors to explore their performance through real-time measurements and microscope demonstrations.

Bringing an ASIC – an application-specific integrated circuit – to market is a complex journey. IC-Link by imec simplifies this process by offering complete ASIC solutions, covering everything from design and IP through fabrication to assembly, testing, qualification, industrialization and supply chain management. As a TSMC value chain aggregator (VCA) since 2007, IC-Link has been enabling customers to leverage TSMC technologies. Additionally, it maintains long-standing partnerships with other major semiconductor foundries, ensuring broad access to advanced manufacturing capabilities.

IC-Link is imec’s division for custom solutions for innovative chip manufacturing.

IC Link by imec offers dedicated and flexible silicon photonics prototyping and manufacturing services specifically tuned to the needs of a single customer using imec's iSiPP 200 platform. The different platforms target cost-effective 200 Gb/s PAM 4 and aims to achieve 400Gb/s in the coming year. The technology is accessible thanks to MPW and dedicated run.

On top of this, Ultra Low Loss SiN photonics is being added to serve various applications and wavelengths beyond the silicon transparency limitations. The versatility of the different platform and in-house expertise help widening the number of applications for various markets such as datacom, AI, quantum and sensors.

IC Link is imec’s division for custom solutions for innovative chip manufacturing.

IC Link by imec offers different types of services to the semiconductor industry and to companies in need of applications with unprecedented precision.

• Supplying semiconductor equipment vendors with fine resolution pattern wafers, nanoimprint masters, for wafer lithography and metrology purposes.

• Full Turn-Key solution for the development of high-end imagers & detectors.

IC Link provides a one-stop solution for specialty chip manufacturing, leveraging its mature process platforms and post-CMOS processing capabilities, and combining a flexible cutting-edge infrastructure, in the 200&300mm process lines, with commercial scalability. This approach enables innovators to develop high-performance, monolithically integrated systems based on semiconductor manufacturing and directly benefit from a reliable supply of component for their businesses.

IC Link is imec’s division for custom solutions for innovative chip manufacturing.

Most industries, including those supporting integrated chip fabrication, contribute to greenhouse gas emissions and other environmental impacts related to, for example, water use and resource extraction. With industry growth, and increasingly complex technologies, this environmental impact will only grow. 

Imec set up the Sustainable Semiconductor Technologies and Systems program, SSTS, to assess, improve and disrupt the fab processes associated with chip manufacturing, with the goal of reducing its environmental impact. Imec developed a web application – imec.netzero – to create a virtual high-volume fab model that can be used to identify hot spots and enable pathfinding for future direction. It is based on detailed information on process flows, process equipment, recipes, fab infrastructure, and libraries of process flows from imec’s 300mm fab and from its industry partners. At this demo booth, you can learn about the IC industry environmental impacts and use the imec.netzero web application.

Superconducting materials are considered a promising alternative to improve the speed, energy efficiency and compactness/size of classic CMOS processors. Their near-zero electrical resistance at cryo-temperatures leads to much more efficient operation for hyperscale AI and HPC. Simulations show a 100x improvement in power consumption for superconducting compute systems considering identical peak compute FLOPs compared to conventional state of the art exascale systems running generative AI workloads.

However, to bring superconducting compute to reality, the semiconductor industry needs to reconsider its processes on all possible levels. Imec’s superconducting project simultaneously tackles new materials and fabrication processes, breakthrough ideas for logic gates and memory, and innovative methods for packaging and system architectures. Imec’s most recent advancements have addressed the fundamental challenges of scaling the critical dimension of superconducting devices, and thus the associated logic and power for the digital building blocks required to make this technology feasible for VLSI.

For next-generation, high-throughput wireless communication – beyond 5G – transceivers are needed with high performance, low power consumption, small footprint and low cost, using frequencies above 6GHz.

Imec researches such radio solutions in its advanced RF program, combining integrated CMOS and III/V devices with novel RF system, architecture and circuit concepts. At this booth, researchers will disclose recent breakthroughs on RF GaN-Si technology for cellular infrastructure and handset applications (FR3 & FR2), next to benchmarking data and the future roadmap. Related to the longer term research, is a hardware demo showing a high data-rate wireless link using imec’s proprietary 140GHz transceiver chip with electronic beamforming technology. This technology can be used for next-generation wireless communication, sensing, gesture recognition and AR/VR.

System architecture innovations are key to handling the fast-evolving workloads of tomorrow, e.g. for artificial intelligence (AI) and high-performance computing (HPC) applications.

Imec performs research on hardware-software codesign to architect post-exascale hardware, exceeding one exaflop operations. In this demo, discover imec’s unique framework to co-optimize hardware and software. This framework includes a powerful tool that provides fast and accurate performance, power, area and cost evaluation. It facilitates design space exploration for AI data centers running large language models, helping to quickly evaluate and optimize design choices.

140GHz radar technology targets automotive applications that require detection of small movements or in the far corners of the car. The advantage of using such high frequencies – 140GHz as compared to 60Ghz used in today’s cars – is improved sensitivity, robustness and smaller size. As compared to e.g. UWB technology, radar technology is more expensive but has a much higher resolution and can detect more details.

Imec develops 140GHz radar chips with integrated antennas, combining all elements on a chip to lower the cost and increase the integration potential – e.g. in the car’s dashboard or rear mirror. At this demo booth, imec highlights the performance of its 140GHz radar chip and algorithms for fine-grained detection. 

Evaluating next-gen (experimental) sensors for autonomous vehicles is a long and costly process and committing to a new type of sensor is a risky endeavour. Simulation tools and digital twin technologies can provide an answer, enabling to explore the impact of changes to the automotive sensor suite on the quality of perception. 

Imec develops digital twin technology for new automotive sensors such as radar, LiDAR, RGB cameras, SWIR imagers, as well as the combination of these sensors (sensor fusion). Come and explore the simulation capabilities based on a high-detail world building around real traffic situations, and the virtual sensor models (including QD-SWIR and FMWC radar.

LiDAR (light detection and ranging) is a critical component in the sensor suite of autonomous vehicles, e.g. for obstacle detection and avoidance, and sensing in challenging conditions such as fog or rain. Miniaturization and cost reduction are today the main drivers for LiDAR development.

Imec is developing a fully solid-state integrated frequency-modulated continuous wave (FMWC) LiDAR sensor, using integrated photonics technology. In this demo, imec shows the latest photonics-based hardware (wafers, packaged chips and stand-alone integrated system) and how it fits into imec’s innovative LiDAR system architecture, enabling both lower cost and higher performance.

Monitoring the health of car drivers and passengers could significantly enhance both well-being and vehicle safety. One effective approach involves using near-infrared (NIR) lasers in combination with camera sensors; this approach is called speckle plethysmography (SPG). SPG uses changes in the speckle pattern – created when laser light interacts with skin – and enables reliable and robust health measurements.

Imec develops the technology and algorithms for SPG-based sensing aimed at vital signs monitoring, in particular heart rate. The demo shows results from field tests with the technology used in actual cars, and the integration approach that resulted in a form factor allowing seamless integration into the rear-view mirror.

Future cars will function as high-performance computers on wheels, powered by chiplet-based processors. Chiplets – compact silicon components designed for specific tasks within a system-on-chip – enable a modular approach, offering faster time to market, cost efficiency, and improved yields.

Through its automotive chiplet program (ACP), imec is setting benchmarks for chiplet interoperability and standardized interfaces – the key to ensuring widespread adoption and reducing integration complexity. Also, imec aims to accelerate and derisk chiplets for automotive, building thermo-mechanical testbeds with stress sensors, temperature sensors, and programmable heaters. In this demo, imec shows finite-element-model simulations and physical samples of these testbeds.

Next-generation semiconductor technologies, such as beyond-2nm systems-on-chip (SoC), are the driving force behind key innovations like autonomous vehicles, personalized medicine, 6G networks, robotics, and quantum computing. Recognizing their strategic importance, the European Chips Act aims to reinforce the semiconductor ecosystem by establishing pilot lines that offer accessible infrastructure for R&D and manufacturing.

As an extension of its existing infrastructure, imec hosts the NanoIC pilot line, a state-of-the-art facility to boost the development and commercialization of beyond-2nm chip technologies. NanoIC offers start-ups, SMEs and suppliers across the value chain access to training and the latest chip infrastructure and research for advanced logic, memory, and interconnect technologies. Visit our booth to learn more about the offering of this pan-European collaboration and how it fosters a more resilient and interconnected industry worldwide.

European-funded projects have been a key driver of research, innovation, and technological development across Europe for decades. Their origins trace back to the formation of the European Union (EU) and its commitment to fostering collaboration between member states. EU-projects significantly contribute to economic growth, jobs, the green and digital transition and competitiveness for the Union industry and economy.

As a global leader in R&D and innovation for nanoelectronics and digital technologies, imec actively coordinates and participates in numerous EU projects, playing a pivotal role in shaping Europe’s innovation landscape. This demo booth showcases results and prototypes from EU-funded projects from different sectors, including compute, health, automotive etc.

The road to autonomous driving presents significant challenges, particularly in ensuring safe and reliable vehicle control in real-world environments. One crucial step in this transition is the development of remote-operated vehicles (ROVs), which can enhance road safety and efficiency while paving the way for future autonomous mobility.

At imec, researchers are advancing key technologies in connectivity, cooperative infrastructure, and AI-powered sensing to improve remote driving capabilities. By optimizing network reliability, integrating vehicle-to-infrastructure (V2I) communication, and leveraging advanced sensing algorithms, imec is contributing to the evolution of smart, connected, and autonomous transport systems. This interactive demo allows visitors to experience a remote-controlled vehicle in action, operated via a portable teleoperation station. The setup showcases imec’s innovations in connectivity and cooperative mobility, illustrating how next-generation technology can improve safety and responsiveness in real-time driving scenarios.

Ensuring cost-effective workplace safety requires reliable and low-cost detection and anticipation of human presence in a 3D environment. Current solutions tend to be costly and power-intensive, relying on expensive sensors (e.g. high-quality lidar) or restricting in their setup (e.g. safety curtains).

Imec is pioneering power-efficient radar-video fusion technology to enhance awareness of human presence in complex dynamic environments. By integrating this with a novel tracking module, the technology enables robust, accurate and energy-efficient determination, localisation and anticipation of human presence.

The demo will show the capabilities of this fusion technology through live radar-video detection of people visiting the booth. 

UWB wireless technology is best known for its use in precise localization and sensing applications. Now it also attracts attention for high-data-rate communications – such as in audio & video streaming, AR/VR and neuro-scientific research – because of the very low energy consumption and small form factor, and because this feature is integrated in the new UWB standard.

Imec develops chips for high-data-rate communication with UWB. To demonstrate its capabilities, researchers will showcase a loss-less audio link by streaming raw audio from source to sink over a wireless UWB link. Also, this will be combined with UWB’s localization capabilities, demonstrating the potential for applications like spatial audio.

Emerging and current time-sensitive applications such as industrial automation, professional multimedia, healthcare, and robotics, today can only rely on wired Ethernet if reliability and latency are key. Also, for wireless connectivity, standardization efforts are complex and slow, and designs with commercial off-the-shelf hardware fall short due to their lack of openness and customization capabilities.

Imec has set up an openwifi open-source initiative, developing Wi-Fi based connectivity solutions with exceptional reliability and latency characteristics as compared to standard Wi-Fi. To unlock its valorisation potential, imec offers access to the codes and features so companies can fully customize this wireless solution for their high-end products. At the demo booth, imec shows the evaluation kit and – as an example – how it can be used to monitor vital signs (live demo with Wi-Fi signal operated in radar mode).

To limit global warming, we need both a drastic reduction of carbon emissions and a way to extract and re-use carbon dioxide from the air. Why not tackle both challenges together?

The idea behind ‘Power-to-Molecules’ is to decarbonize industries by producing renewable hydrogen in the first stage and converting carbon dioxide to renewable fuels or chemical building blocks in the next stage. To get this done, imec/EnergyVille is working on solutions to make large-scale green hydrogen a reality and to generate hydrocarbons from recycled carbon dioxide. This interactive demo shows different energy and CO₂ utilization scenarios as well as a functional mini-electrolyser, making renewable molecules.

The journey towards a sustainable future hinges on our ability to harness the power of renewable sources effectively. Solar energy, in particular, has emerged as a cornerstone of this transition. However, the unpredictable and variable nature of sunlight poses a significant challenge for an efficient use of the sun’s energy in global energy production.

Within their partnership at EnergyVille, imec and Hasselt University have tackled this obstacle head-on, through a groundbreaking energy yield model. Unlike traditional models, this bottom-up approach intricately considers light, temperature, and electrical dynamics within solar panels. It offers unparalleled precision and can become a beacon for efficient solar energy utilization. In this interactive demo, the research partners showcase the energy yield modelling software and how different PV technologies, environmental conditions and application constraints impact energy production.

Ubiquitous use of environmental sensors is essential to identify sources of emissions and the effects of emission-reduction measures. For this, one would need small, low-cost, accurate sensors.

Imec combines its expertise in sensor technology, integrated photonics and wireless beam-steering technology to develop unique environmental sensors. In this demo, imec shows a sensor prototype, able to detect several gases using a photonic chip with hybrid integrated laser – tuneable over a wide bandwidth – and beam-steering technology to switch between gas types.

Artificial Intelligence (AI) is transforming industries worldwide, driving automation, efficiency, and innovation across sectors like healthcare, manufacturing, logistics, and biotechnology. As AI becomes a cornerstone of economic growth and technological advancement, regions that invest in AI research and development position themselves as global leaders.

Imec coordinates the Flanders AI Research Program, with the aim of promoting AI adoption in Flanders by funding new researchers and developing practical use cases to inspire further AI adoption. The program gathers AI experts from all five Flemish universities and all strategic research centers to develop generic AI-solutions for real-life problems in the domains of health, industry, planet & energy, and society. Learn all about this research, and how you can adopt it in your organization at our booth.

Flanders’ knowledge-driven economy brings industry and research partners together in its cutting-edge research. Imec and its program partners consistently seek new breakthroughs in industrial and educational technologies, some of which you can discover in the Flanders Connect booth:

• Smart Education @ Schools, in which imec tackles classroom challenges in primary, secondary and adult education with teacher-driven tech solutions. One such project is the ‘Spellingsmonitor’, a program with handwriting recognition that can provide instant feedback to students.

• The imec.ICON and PROSPECT projects, interdisciplinary research that shapes the future of healthcare, mobility, lifelong learning, etc. One research track imec is particularly proud to present is the use of AI in the discovery and development of new medicine, to shorten its production duration and lower its cost.The imec.DIGIMETER, a crucial insight into digital trends, continuously updated to accurately reflect Flanders’ current approach to and appreciation of AI adoption, digital inclusion, media consumption, and much more.

• Solid Technology, personal data vaults ensuring personal privacy by allowing citizens to gain control of their own health, mobility and education data.

• Connected, Tele-Operated and Autonomous Driving, a chance to experience future mobility in action, through the visionary live demo at booth 45 (the driver) and 37 (the vehicle).

We are entering an era where humans and robots coexist in shared environments such as warehouses, assembly lines, and restaurants. Deploying robots in unstructured, human-centric settings presents challenges that require robust perception and planning.

Imec develops specialized sensors and algorithms for robots operating in these environments. In this demo, a mobile robot acts as a bartender, listening to your requests, picking drinks from a fridge, and serving them to you. Through sensor fusion with imec’s SAFEBOT robotic perception platform, machine learning, and planning algorithms, the robot operates efficiently and safely around humans.

In traditional manufacturing, robots operate in highly controlled settings, where objects always arrive in the same position and orientation, allowing for preprogrammed, repetitive tasks. However, in dynamic environments, such predictability is impossible. Factories, warehouses, and even homes require robots to handle a wide variety of objects with different shapes, weights, and configurations - often in the presence of human activity. Furthermore, different types of sensors are required to sense different types of tactile modalities such as shear forces for detecting slippage and vibrations for texture recognition. 

Imec develops specialized sensors and algorithms for robots in dynamic environments. We showcase different types of sensors for different tactile modalities. Take, for example, the challenge of folding clothes for laundry purposes: how can a robot detect the edges of the cloth, how does it know where to grasp the cloth for efficient folding, how much pressure should it apply to different textiles? This demo highlights new developments in this field of flexible robotic systems that require a sense of touch, such as handling cloth.

Robots excel at precision and repetition, but when it comes to handling delicate or unpredictable objects, they still fall short of human capabilities. Unlike humans, they lack a sense of touch and operate purely on visual guidance.

This demo showcases a 'smart touch' robotic system working in static and dynamic situations with a wide variety of objects. It is the result of a collaboration between Melexis and imec. Melexis's magnetometer-based 3D tactile sensor provides the robot with an exceptional sense of touch, detecting both normal and shear forces. Imec integrates this sensor with a robotic gripper, combining it with vision and Generative AI (GenAI). The robot first uses vision to assess an object (estimating weight, friction and optimal grasping pose), while the 3D touch sensors provide real-time feedback during grasping. Visitors will witness the robot's ability to manipulate objects in different scenarios, demonstrating how the combination of vision, advanced tactile sensing, and AI enables near-human dexterity.

Real-world environments can be dynamic, with changing weather, lighting, terrain, or obstacles, requiring robots to constantly adapt. In agriculture especially, future robots must handle a wide range of tasks with different levels of complexity, requiring adaptability and sometimes even learning new behaviours on the fly.

In fruit orchards, branch pruning is essential for healthy tree growth and stable fruit yields. However, precision pruning is physically demanding and labour-intensive, with skilled workers becoming increasingly difficult to find. That’s why robots are being considered as pruning assistants in orchard management. Autonomous precision pruning requires a holistic view of the full tree structure and a more detailed view of the branches.

This challenge is overcome by imec’s technology on multi-sensor mapping to create a high-resolution 3D scan of the full tree in a highly efficient manner, while deep learning based on 3D point clouds determines which branches need to be pruned. A robotic arm autonomously controls a cutting tool to remove branches while avoiding obstacles and planning its movements in a highly constrained environment. OnePlanet Research Center envisions that the challenges of robotic actuation in complex environments like agriculture will be overcome by advancements in 3D sensor fusion, AI, robust hardware and improved human-robot interaction strategies.