Panel discussion: 'Future of foundry services on next gen photonics'

The exponential growth of data driven by AI, quantum computing, LiDAR, and next-generation communications demands a revolution in photonic integrated circuits (PICs). This panel will delve into the critical role of industrializing photonic heterogeneous integration to unlock the full potential of these transformative technologies. We will explore how leveraging diverse material systems and advanced integration schemes can overcome the limitations of monolithic approaches, driving performance and scalability for future applications.
Industry players from across the photonics supply chain—including foundries, packaging experts, testing innovators, and research institutions—will converge to discuss the key challenges and opportunities in establishing an ecosystem.