The Role of Packaging in the Next Wave of Emergent Opportunities

The Role of Packaging in the Next Wave of Emergent Opportunities
IC packaging is playing an increasingly important role in the growing demands of AI and other high-performance applications. The packaging community has accelerated its pace in pushing the boundaries of performance and integration by establishing a robust packaging roadmap that aligns with emerging market trends as well as meeting the challenges of complex chip designs and system architectures.

As we navigate through the roadmap, much of the recent industry focuses have been placed upon advanced packaging for AI.  If we view this development as the beginning of a megatrend, what will be the implications for the longer term?  Likewise, what are the potential opportunities for edge devices and applications, and where are the bottlenecks gating potential growth?  

We’re just at the beginning of an exciting era. And diving deeper into the technological aspects of the roadmap will offer crucial insights as to why various segments of the industry should collaborate to capture the emergent AI, Cloud and Edge Computing opportunities.