Accelerating innovation: pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS)

The availability of semiconductor chips is vital for the European economy and its innovation landscape. Digital transformation is creating new markets and opportunities within the chip industry, particularly in sectors such as autonomous driving, cloud computing, edge sensing and computing, and connectivity. As technology node scaling becomes increasingly challenging, heterogeneous integration will play a crucial role in advancing microelectronics for future applications. The Research Fab Microelectronics Germany (FMD) proposes a Pilot Line (PL) for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS). This initiative will incorporate cutting-edge methodologies for characterization, quality assurance, testing, and reliability, alongside innovative test methods to evaluate the security of microelectronic systems against physical threats. Additionally, a System Technology Co-Optimization (STCO) framework will be established. The APECS Pilot Line aims to serve a diverse customer base in basically all classic vertical industrial sectors, including large corporations, SMEs, technology start-ups throughout Europe.