Multi-chip-module with in-package WDM silicon photonics transceiver (15')

Optical I/O provides a path to power efficient, high-bandwidth solution for distributed and disaggregated compute nodes. We will discuss the design of in-package optical transceiver that integrates electrical integrated circuit (EIC) in 7nm FinFET and a silicon-photonic integrated circuit (PIC) in GF 45CLO. The transceiver implements a 16-lambda O-band wave-division multiplexing (WDM) at 53Gbps throughput per lambda. The packaging solution includes the use of a fine pitch integrated fan-out (InFO) package and an organic interposer.